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Eurofighter Typhoon
The suite of class 10 processing modules and class 10000 assembly cleanrooms are used to support a wide range of projects. The work carried out in the cleanrooms ranges from one off single metal layer depositions to production runs of Delay Lines for the Eurofighter programme.
Processes available in the class 10 clean rooms include contact photolithography able to define features as small as 1mm across a 3 inch wafer in photoresist or polyimide. Thermal evaporation and lift off of a wide range of metals including gold, chrome, aluminium and zinc. A wide range of materials can be sputter deposited once a target is procured, current targets include gold, aluminium, titanium, copper, tungsten, nickel, chrome and silicon dioxide.
Material etching can be carried out by Ion Beam Milling, reactive ion etching and wet chemical etching. A vacuum cold weld bonder developed and built in house is also located in the class 10 modules. Processing carried out in the class 10000 cleanrooms include lapping and optical polishing on a wide range of materials and wafer sawing.
The class 10000 assembly cleanrooms house a suite of wire bonders capable of gold ball and tape bonding and aluminium wedge bonding using a range of wire sizes. Other assembly and test equipment include a seam welder, gross and fine lean testers, acceleration tester, and temperature cycling ovens.
Our two state-of-the-art class 100 – 10,000 cleanrooms provide a comprehensive suite of equipment and services:
Fabrication Processes
- Photolithography
- Wafer Bonding
- Physical Vapour Deposition
- Chemical Vapour Deposition
- Spin Coat Deposition
- Screen Print Deposition
- Electroplated Deposition Processes
- Wet Etch processes, both anisotropic and isotropic
- Dry Etch processes (Parallel Plate, Reactive and Deep Reactive Ion Etching (RIE & DRIE)
- Laser Ablation
Packaging
- Wafer saw
- Wedge wire-bonder
- Ball wire-bonder
Characterisation
- Microscopy (optical, electron and atomic force)
- Linewidth Topography (profilometry, non contact optical interferometry)
- Resistivity Analytical and probe card test stations
- Film thickness (profilometry, interferometry and ellipsometry)
- Composition (Surface Analysis, X-ray Diffraction, IR and UV spectroscopy and many more)
- Wafer bow and stress measurements from room temperature to 500°C
- Environmental stressing (temp, humidity, salt spray)
- Ultrasonic and real time micro-focus X-ray imaging
