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Encapsulation Process Capability

Encapsulation process capability

Encapsulation process capability

Wide range of encapsulation processes available to meet the requirements of the Insyte manufacturing facility.

Key Performance Features

  • Parylene deposition for coating of conventional PECs, microwave substrates, antenna assemblies and high voltage electronic assemblies.
  • Vacuum impregnation using an autoclave for encapsulation of high voltage equipment.
  • Spraying application of conventional conformal coating (varnishes etc).
  • Encapsulation using all types of epoxy resins and adhesives.
  • Vapour condensation re-flow capability, and Mass Spectrometer.

Contact

Keith Ford – SMT Team Leader
keith.ford@baesystems.com
+44 (0) 2392226761/6158

Facility Location

Broad Oak,
The Airport,
Portsmouth,
Hants,
PO3 5PQ


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